Effects of the strain transmission from the main board to the installed electronic components
Вантажиться...
Дата
2016
Автори
Kovtun, І.
Boiko, J.
Petrashchuk, S.
Baurienė, G.
Pilkauskas, K.
Ковтун, Ігор Іванович
Бойко, Юлій Миколайович
Петращук, Світлана Анатоліївна
Назва журналу
Номер ISSN
Назва тому
Видавець
Kaunas university of technology
Анотація
The paper presents research of mechanical strain in
printed circuit board functional assemblies, which are parts
of electronic packages in modern machines and mechanisms.
The strain is caused by external impacts that occur in
manufacturing and exploitation conditions. The paper studies
effects of the strain transmission from the main board to
the installed electronic components, such as integrated circuits,
discrete components, adapters, sockets, connectors,
electronic modules etc.: mount stress in electronic components;
strain effect of electronic component installation
technologies; strain effect of integrated circuit installation
technology; the influence of the main board load duration
on the strain in mounted electronic modules; the strain in
contact pads produced by bending of the main board. Acceptable
limit specification method for main board warpage
is developed.
Опис
Optimization of electronic assembly pins quantity
minimizes mount stress effect on electronic components.
Developed high through-hole installation technology
of electronic components on the main board provides
significant reducing of the strain transmitted to electronic
components in comparison with standard low through-hole
and surface-mount installation.
The strain in integrated circuits mounted on the
main board depends on rigidity and design of their pins. The
offered soft installation technology 3-4 times reduces strain
in comparison with the solid installation.
Hollow electronic modules are more sensitive to
main board deformation than the encapsulated ones. The
strain in electronic modules changes depending on duration
of the main board deformation they are installed on.
The deformation produced by the main board onto
contact pads (assumed to be weak links of the whole structure)
in electronic modules is found to be dependent on connecting
leads or pins, and decreasing their rigidity or applying
compensators can significantly reduce the influence of
the main board onto the electronic components. The measured
strain in case of soft installation technology is 3-4 times
lower than the strain in solid installation.The developed method for acceptable limit specification
of PCB warpage is applicable for any design of electronic
modules and any installation technology.
For the more detailed research of the strain in electronic
components, which are relatively small objects, the
further research will be aimed at application acoustic emission
method in order to develop methods for strength diagnostics
and predicting possible breakages at the stage long
before a fatal destruction in electronic packages.
Ключові слова
strain, deformation, pure bending, warpage, main board, electronic component
Бібліографічний опис
Effects of the strain transmission from the main board to the installed electronic components / I. Kovtun, J. Boiko, S. Petrashchuk, G. Baurienė, K. Pilkauskas // Mechanika. – 2016. – Vol. 22, Iss. 6. – P. 489-494.