(Kaunas university of technology, 2016) Kovtun, І.; Boiko, J.; Petrashchuk, S.; Baurienė, G.; Pilkauskas, K.; Ковтун, Ігор Іванович; Бойко, Юлій Миколайович; Петращук, Світлана Анатоліївна
The paper presents research of mechanical strain in
printed circuit board functional assemblies, which are parts
of electronic packages in modern machines and mechanisms.
The strain is caused by external impacts that occur in
manufacturing and exploitation conditions. The paper studies
effects of the strain transmission from the main board to
the installed electronic components, such as integrated circuits,
discrete components, adapters, sockets, connectors,
electronic modules etc.: mount stress in electronic components;
strain effect of electronic component installation
technologies; strain effect of integrated circuit installation
technology; the influence of the main board load duration
on the strain in mounted electronic modules; the strain in
contact pads produced by bending of the main board. Acceptable
limit specification method for main board warpage
is developed.