The Method for Cleaning Soils from Sludge in Manufacture of Printed Circuit Boards and Electroplating
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Дата
2020-12-20
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Видавець
Journal of Environmental Research, Engineering and Management
Анотація
This article is devoted toare searchon the ecological state of territoriesof the enterprises with a galvanic workshop that produces printed circuit boards. The main aspects of the negative impact of the circuit board and electroplating productionwaste on the environment are briefly outlined.
Опис
The goal of this work is to improve the method for assessing the impact of wastewater on soil salinity in the territory of the printed circuit board enterprise. The object of research is the process of extraction and use of copper from wastewater, which was formed as a result of the production of circuit boards and electroplating.
Ключові слова
production of printed circuit boards, regeneration, etching, solutions, environmental hazard, sludge
Бібліографічний опис
Nester А. А., Tretyakova L.D., Mitiuk L.О., Prakhovnіk N.А., Husiev A.M. Remediation of Soil Containing Sludge Generated by Printed Circuit Board Production and Electroplating // Journal of Environmental Research, Engineering and Management. 2020. № 4. С. 68-75.