The Method for Cleaning Soils from Sludge in Manufacture of Printed Circuit Boards and Electroplating

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dc.contributor.authorNester, A.A.
dc.contributor.authorTretyakova, L.D.
dc.contributor.authorMitiuk, L.О.
dc.contributor.authorPrakhovnіk, N.А.
dc.contributor.authorHusiev, A.M.
dc.date.accessioned2021-03-25T15:57:46Z
dc.date.available2021-03-25T15:57:46Z
dc.date.issued2020-12-20
dc.descriptionThe goal of this work is to improve the method for assessing the impact of wastewater on soil salinity in the territory of the printed circuit board enterprise. The object of research is the process of extraction and use of copper from wastewater, which was formed as a result of the production of circuit boards and electroplating.uk_UA
dc.description.abstractThis article is devoted toare searchon the ecological state of territoriesof the enterprises with a galvanic workshop that produces printed circuit boards. The main aspects of the negative impact of the circuit board and electroplating productionwaste on the environment are briefly outlined.uk_UA
dc.identifier.citationNester А. А., Tretyakova L.D., Mitiuk L.О., Prakhovnіk N.А., Husiev A.M. Remediation of Soil Containing Sludge Generated by Printed Circuit Board Production and Electroplating // Journal of Environmental Research, Engineering and Management. 2020. № 4. С. 68-75.uk_UA
dc.identifier.urihttps://elar.khmnu.edu.ua/handle/123456789/10174
dc.language.isoenuk_UA
dc.publisherJournal of Environmental Research, Engineering and Managementuk_UA
dc.subjectproduction of printed circuit boardsuk_UA
dc.subjectregenerationuk_UA
dc.subjectetchinguk_UA
dc.subjectsolutionsuk_UA
dc.subjectenvironmental hazarduk_UA
dc.subjectsludgeuk_UA
dc.titleThe Method for Cleaning Soils from Sludge in Manufacture of Printed Circuit Boards and Electroplatinguk_UA
dc.typeСтаттяuk_UA
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