Розрахунково-експериментальні методи оцінювання міцності металоскляних виробів реа
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Файли
Дата
2020
Автори
Горошко, А.В.
Ковтун, І.І.
Крушинський, Д.О.
Goroshko, A.
Kovtun, I.
Krushynskyi, D.
Назва журналу
Номер ISSN
Назва тому
Видавець
Хмельницький національний університет
Анотація
У статті представлені результати досліджень міцності склоспаїв у виробах електронної техніки. Проведено
розрахунок допустиму розкиду фізико-механічних характеристик матеріалів вузла склоспаю, що забезпечують виконання
умови міцності склоспая, і запропоновано здійснюючи вхідний контроль фізико-механічних характеристик використаних
матеріалів з подальшим погодженням їх партій. Запропонована методика проектного розрахунку на міцність вузлів
металоскляних фотодатчиків РЕА.
The experience of using metal-glass electronics products indicates their low reliability due to mechanical destruction. As a rule, failure is caused by the insufficient ability of incandescent glass to wet the metal to form a tight bond, as well as by the inconsistent thermal expansion of glass and metal, which can cause a decrease in strength and depressurization of the seal when the assembly is cooled. The paper presents the results of studies of the strength of glass-sealed in electronic products. It is shown that the theory of thick-walled Lamé cylinders can be used for the calculation. The calculation of the permissible scatter of the physical and mechanical characteristics of the materials of the glass-weld assembly, ensuring the fulfillment of the strength condition of the glass-weld, was carried out, and it was proposed to carry out the incoming control of the physical and mechanical characteristics of the materials used with the subsequent approval of their batches. A method of design calculation for the strength of units of metal-glass photosensors of electronic equipment is proposed. In, a new design and technological concept of sealing electronic modules in aluminum alloy housings using a multifunctional coating based on Ni and Si, obtained by pulsed laser surfacing. A formula for determining the mobility of surfacing of one layer, taking into account which find the total duration of laser surfacing and the formation of a multifunctional coating. In it is noted that indium and some of its alloys can be used as a solder capable of wetting glass, ceramics and metals and connecting them together. Indium has a low melting point and is very mild; softness allows it to plastically deform and absorb stress due to the mismatch of thermal expansion. Due to the very low pressure, indium vapor is used in glass-metal seals used in vacuum technology and cryogenic applications.
The experience of using metal-glass electronics products indicates their low reliability due to mechanical destruction. As a rule, failure is caused by the insufficient ability of incandescent glass to wet the metal to form a tight bond, as well as by the inconsistent thermal expansion of glass and metal, which can cause a decrease in strength and depressurization of the seal when the assembly is cooled. The paper presents the results of studies of the strength of glass-sealed in electronic products. It is shown that the theory of thick-walled Lamé cylinders can be used for the calculation. The calculation of the permissible scatter of the physical and mechanical characteristics of the materials of the glass-weld assembly, ensuring the fulfillment of the strength condition of the glass-weld, was carried out, and it was proposed to carry out the incoming control of the physical and mechanical characteristics of the materials used with the subsequent approval of their batches. A method of design calculation for the strength of units of metal-glass photosensors of electronic equipment is proposed. In, a new design and technological concept of sealing electronic modules in aluminum alloy housings using a multifunctional coating based on Ni and Si, obtained by pulsed laser surfacing. A formula for determining the mobility of surfacing of one layer, taking into account which find the total duration of laser surfacing and the formation of a multifunctional coating. In it is noted that indium and some of its alloys can be used as a solder capable of wetting glass, ceramics and metals and connecting them together. Indium has a low melting point and is very mild; softness allows it to plastically deform and absorb stress due to the mismatch of thermal expansion. Due to the very low pressure, indium vapor is used in glass-metal seals used in vacuum technology and cryogenic applications.
Опис
Ключові слова
склоспай, фотодатчик, міцність, електронні вироби, Glass-to-metal seal, Photosensor, Strength, Electronic Products
Бібліографічний опис
Горошко А. В. Розрахунково-експериментальні методи оцінювання міцності металоскляних виробів РЕА / А. В. Горошко, І. І. Ковтун, Д. О. Крушинський // Вимірювальна та обчислювальна техніка в технологічних процесах. – 2020. – № 2. – С. 17-21.